Collaboration enables SoC manufacturers to improve their qualification envelope to achieve lifetime reliability, shorten their root cause analysis time, and reduce operational costs HAIFA, ...

This report responds to a request from the U.S. Department of Defense (DOD) to identify engineering practices that have proved successful for system development and testing in industrial environments.

Chipmakers are increasingly turning to advanced packaging to overcome the reticle size limit of silicon manufacturing without increasing transistor density. This method also allows hybrid devices with ...

http://www.maxwell.comSystem reliability concerns are imperative to the implementation of today's broadband wireless infrastructure. Wireless networks require new ...

Suppliers of gallium nitride (GaN) and silicon carbide (SiC) power devices are rolling out the next wave of products with some new and impressive specs. But before these devices are incorporated in ...